Serial number | name | type |
Authorization No |
1 |
Anti-electromagnetic interference structure of multilayer printed circuit board |
Invention patent | ZL200710182345.3 |
2 |
An efficient special embossing device for flexible circuit board |
utility model | ZL201821851244.0 |
3 |
A fully closed symmetric rigid-flexible composite plate | utility model | ZL201821851245.5 |
4 |
A special opening device for circuit board | utility model | ZL201821851401.8 |
5 |
A high-precision multi-layer OSP board | utility model | ZL201921655041.9 |
6 |
Electroplated HDI board with high and multi-layer blind holes | utility model | ZL201921656488.8 |
7 |
Multilayer PCB board with ultra-small spacing drilling | utility model | ZL201921595542.2 |
8 | A soft and hard combination board of PI and high-frequency mixed pressure | utility model | ZL201921595547.5 |
9 |
A high frequency mixed voltage multilayer circuit board
| utility model | ZL201921595570.4 |
10 |
High-precision multi-layer OSP board products |
new and high-tech product | 201924363 |
11 |
Ultra-small hole spacing flexible circuit board products | new and high-tech product | 201924362 |
12 |
High-density rigid-flex composite plate products | new and high-tech product | 201924364 |