Process items |
Conventional capabilities |
Ultimate capacity |
Minimum plate thickness | Single/double sided FPC
| 0.08mm/0.12mm | 0.05mm/0.10mm |
Plate thickness tolerance | T≥0.15mm | ±0.03mm | ±0.03mm |
T＜0.15mm | ±0.02mm | ±0.02mm |
Minimum line width line spacing | line | 0.07/0.07mm | 0.03/0.03mm |
Minimum hole diameter | drill hole | 0.15mm | 0.05mm |
CoverlayAlignment accuracy | ±0.20mm | ±0.05mm |
Written words | Screen printing accuracy | ±0.30mm | ±0.10mm |
Text height | 0.80mm | 0.70mm |
Reinforcement alignment accuracy | FR4 | ±0.30mm | ±0.10mm |
PI | ±0.30mm | ±0.10mm |
Surface treatment | Chemical gold | Au:0.03~0.075um Ni:2-8um | Au:0.025~0.075um Ni:2-5um |
Electrogold | Au:0.03~1.0um Ni:2-8um | Au:0.025~1.0um Ni:2-5um |
OSP | Film thickness 0.2-0.4um
| Film thickness 0.1-0.3um
|
Blind hole | Maximum aperture depth ratio | 1:0.6 | 1:0.8 |
Dimple | ≤0.02mm | ≤0.02mm |